PC

Bambu Lab

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$39.99
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Product Overview

AMS Compatable!
Enclosure Printers Required
Dry out before use

  • Exceptional Thermal Resistance
  • Excellent Mechanical Properties
  • High Impact Strength and Durability
  • Suitable for Engineering Purpose
  • Comes with High Temperature Reusable Spool
  • Diameter: 1.75mm +/- 0.03mm

Recommended Print Settings:

Drying Settings (Blast Drying Oven) 80 °C,8h
Printing and Keeping Container's Humidity < 20% RH (Sealed, with Desiccant)
Nozzle Temperature 260 - 280 °C
Bed Temperature (with Glue) 90 - 110 °C
Printing Speed < 300 mm/s


Physical Properties:

Density 1.20 g/cm³
Vicat Softening Temperature 119 °C
Heat Deflection Temperature 117 °C
Melting Temperature 228 °C
Melt Index 32.2 ± 2.9 g/10 min


Mechanical Properties:

Tensile Strength 55 ± 4 MPa
Breaking Elongation Rate 3.8 ± 0.3 %
Bending Modulus 2310 ± 70 MPa
Bending Strength 108 ± 4 MPa
Impact Strength 34.8 ± 2.1 kJ/m²

 

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